This one-day class examines and explains the key enabling technologies that are changing the world of microelectronic manufacturing today and those that promise to revolutionize it tomorrow.

Course Description:

Until very recently the world of semiconductor manufacturing was one in which change was rapid and evolutionary. Today, a range of new manufacturing technologies have appeared that have precipitated a paradigm shift that is both disruptive and revolutionary. Indeed, the pace and capabilities of these new technologies has rendered more traditional semiconductor manufacturing techniques obsolete, and changed the face of modern silicon processing.

This course presents a technically accurate and detailed assessment of these new technologies, explains how they work, where they are used, and how they are changing the science of microchip manufacturing. The topics that are covered include:

• Atomic Layer Deposition

• Strained Silicon

• Hi-K Dielectrics

• Metal Gate Electrodes

• Cu/Low-K Dielectrics

• Silicon-On-Insulator

• Nickel Silicide

• Ultra-Shallow Junctions

The course is intended for Designers, Wafer Fab Engineers, Engineering managers, and others who are familiar with the basics of Silicon processing, but who have a requirement to become conversant with the new and more advanced silicon processing technologies.

COST: $595/Student

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