CMOS Process Integration for 28 nm Logic

The course has been newly updated to include all of the latest developments in FinFet fabrication and is technically current through May 2013.

Course Description:

This one-day course provides a step-by-step explanation of current state-of-the-art silicon fabrication focusing on the details of a 28 nm planar Logic process flow. All aspects of the 28nm fabrication process are discussed in depth and both gate-first and gate-last integration methodologies are presented. Both back-end and Front-end processes are described in detail.

The course highlights the importance of each topic it treats in the context of real world of commercial semiconductor manufacturing and is designed to provide a deeper understanding of silicon processing and the emerging new technologies that are revolutionizing this field.

The final section of the class provides an overview of 22nm FinFet processing and an analysis of the Intel implementation of the FinFet. This portion of the class is profusely illustrated with numerous photographs.

The class notes are technically current, in full color and extensively illustrated with state-of-the-art 2D and 3D graphics. They feature numerous cross-sectional and top-down SEM and TEM photographs of leading edge commercial device structures.

The course is targeted at Designers, R&D, Product, Device, Test and Process engineers, managers and other personnel who desire a deeper understanding 28nm planar Logic and an introduction to 22nm FinFet fabrication.

The course content is presented in a clear, highly visual and easy-to-understand manner. It is taught by a world-class instructor who has over 20 years of hands-on experience in the field of silicon fabrication and who is an award winning public speaker.

Download this seminar brochure as a .pdf file

Date: May 17, 2013

Location: Semi Headquarters, 3081 Zanker Road, San Jose, CA 95134, USA

Tuition: $695

What’s Included:

• A full day of instruction by an industry expert with an in-depth understanding of the course material.
• A high quality set of course notes that are in full color.
• Continental breakfast, hot buffet lunch and snacks at the morning and afternoon breaks.

Who is the seminar intended for:

• Process Engineers & Scientists
• Device Engineers & Scientists
• Product Development Managers, Engineers, & Scientists
• IC Product Engineering or Marketing Personnel
• Materials Supplier Marketing, Applications, & Product Development Managers, Engineers, & Scientists
• Semiconductor Manufacturing Engineers & Managers
• VLSI Design Engineers
• Field Applications Engineers
• Patent attorneys

Course Topics:

• Process Integration – an introduction to the basic modules
• Shallow Trench Isolation: planar, FinFet-on-bulk and FinFet on SOI
• Strained silicon implementation using SiC and SiGe replacement Source/Drains
• Ion implantation details: modern Extension, Halo and Contact implants
• Nickel Salicidation integration methodologies
• Planar gate electrode formation
• Planar gate-first integration methodology
• Planar replacement gate (gate-last) integration methodology
• High-k/metal gate integration strategies
• FinFet fabrication strategies: gate-first, replacement gate and FinFet on SOI
• FinFet contact integration methodologies
• Key fabrication details of FinFet manufacturing
• Tungsten contact plugs, tungsten trench contacts, copper contact plugs and copper trench contacts

The Instructor:

Jerry Healey

Jerry Healey has been a technical professional in the semiconductor industry for over 20 years, 8 years of which were spent as a Device Engineer at Motorola Semiconductor. He was formerly an instructor for UC Berkeley Extension (College of Engineering), and more recently was employed as a Process Integration Engineer at the Advanced Technology Development Facility, where he worked on advanced technology node development.

He is a renowned lecturer in the field of silicon processing, and his areas of expertise include process integration, technology transfer of new processes from R&D into manufacturing, embedded non-volatile memory processing, and mixed signal devices. His audiences remember him for the breadth of his knowledge regarding semiconductor manufacturing, his engaging lecture style, and the insightful color graphics he uses to illustrate his lectures.

An award winning public speaker, Mr. Healey has taught numerous courses to thousands of practicing engineers and scientists over the past 15 years. He has also authored numerous papers in the field of silicon processing, and is currently the president of Threshold Systems, a firm that provides consulting services and technical training seminars to the semiconductor industry.

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Testimonials

“As a logic design engineer I've never been given any training in how the chips are physically made and I found the information in this course to be fascinating. Every hardware design engineer should take this course.”  - T. Jameson

“Jerry Healey has the ability to make difficult and complex information seem easy and readily comprehensible. His color graphics are just superb.” – K. Anderson