Fundamentals of Microchip Design and Fabrication
The course has been newly updated to include all of the latest developments in 3D packaging and is technically current through March 2012.
This one-day course provides an excellent introduction to the science of IC design and fabrication as well as an overview of microchip packaging. This course is introductory in nature, explanatory in tone, and covers the most basic concepts of microchip design and manufacturing in simple, easy-to-understand terms. It is ideally suited for new-hires and a wide range of industry personnel who are interested in learning the basics of microchip technology.
What’s Included:
- A full day of instruction by an industry expert with an in-depth understanding of the course material.
- A high quality set of course notes that are in full color.
- Continental breakfast, hot buffet lunch and snacks at the morning and afternoon breaks.
Date: March 26, 2012
Location: Semi Headquarters, 3081 Zanker Road, San Jose California.
Seminar Fee: $695.00
Download this seminar brochure as a .pdf file
Who is the seminar intended for?
- New-hire engineers, technicians, designers, and managers
- Marketing personnel, Sales representatives, Public Relations personnel
- Legal counsel
- Technical Writers
- Tool and Material vendors
- Production personnel, Customer service, and application engineers
- Any employee who requires an overview of microchip design and fabrication
Course Description:
To the uninitiated, microchip technology is a bewildering subject filled with confusing jargon, strange equipment and exotic technology. Indeed, microchip manufacturing is so complex that the engineers involved in the field appear to be speaking an incomprehensible dialect of English that is all their own.
This course demystifies the subject of microchip design and fabrication by presenting a clear and concise overview of the subject in language that can be understood by non-technical personnel. It begins with defining basic electrical principles such as current, voltage and resistance, and then describes how fundamental devices such as transistors, capacitors and diodes function. It then progresses to descriptions of the microchip design process and illustrates the manner in which modern IC circuits are laid-out.
The course next covers CMOS devices (PMOS and NMOS), and digital versus analog circuitry, followed by the presentation of a simplified microchip fabrication sequence and the equipment used in the fabrication process.
Finally, an overview of the packing process is presented and the various types of packing types are described.
The class is taught in a highly interactive style with key question reviews for each module. In-class exercises are provided, as well as a set of high-quality color notes that are profusely illustrated.
Course Topics:
Basic Electronics - Voltage, Current, Resistance, electrical circuits, Ohm's Law, electrical components (transistors, capacitors, diodes, resistors)
Semiconductor Fundamentals - the PN junctions (forward and reversed bias), MOSFETs, PMOS, NMOS, CMOS
Microchip Design - Logic gates, physical layout, Logic design, simulation tools, chip layout, design rule checks, mask generation, silicon prototype and debug, design revision and final qualification
Silicon Processing Technology - Atomic Layer Deposition (ALD), Chemical Mechanical Polishing (CMP), Chemical Vapor Deposition (CVD), Cleaning technology, Electro-plating, Etch, Ion Implantation, Lithography, Physical Vapor Deposition (PVD), and Rapid Thermal Processing (RTP)
Microchip Fabrication - A step-by-step fabrication sequence for a modern microchip is described in detail
Microchip Packaging - the backend process flow, wire bonding, Chip Scale Packaging (CSP), Stacked CSP, Wafer Level Packaging (WLP), the flip-chip process, System-in-Package (SiP), Multi-Chip-Modules (MCM), System on Chip (SoC), stacked die, Package-in-Package (PiP), 3D Packaging
The Instructor:
JERRY HEALEY
Jerry Healey has been a technical professional in the semiconductor industry for 20 years, 8 years of which were spent as a Device Engineer at Motorola Semiconductor. He was formerly an instructor for UC Berkeley Extension (College of Engineering), and more recently was employed as a Process Integration Engineer at the Advanced Technology Development Facility, where he worked on advanced technology node development.
He is a renowned lecturer in the field of Silicon Processing, and his areas of expertise include process integration, technology transfer of new processes from R&D into manufacturing, embedded non-volatile memory processing, and mixed signal devices. His audiences remember him for the breadth of his knowledge regarding semiconductor manufacturing, his engaging lecture style, and the insightful color graphics he uses to illustrate his lectures.
An award winning public speaker, Mr. Healey has taught numerous courses to thousands of practicing engineers and scientists over the past 20 years. He has authored and co-authored numerous papers in the field of Silicon Processing, and is currently the president of Threshold Systems, a firm that provides consulting services and technical training seminars to the semiconductor industry.
“Jerry Healey is a superb public speaker who has a knack for making complex technical subjects seem clear and understandable.” - J. Blume, AMD