This one-day course provides an excellent introduction to the science of IC design and fabrication as well as an overview of microchip packaging. This course is introductory in nature, explanatory in tone, and covers the most basic concepts of microchip design and manufacturing in simple, easy-to-understand terms. It is ideally suited for new-hires and a wide range of industry personnel who are interested in learning the basics of microchip technology.

Course Description:

To the uninitiated, microchip technology is a bewildering subject filled with confusing jargon, strange equipment and exotic technology. Indeed, microchip manufacturing is so complex that the engineers involved in the field appear to be speaking an incomprehensible dialect of English that is all their own.

This course demystifies the subject of microchip design and fabrication by presenting a clear and concise overview of the subject in language that can be understood by non-technical personnel. It begins with defining basic electrical principles such as current, voltage and resistance, and then describes how fundamental devices such as transistors, capacitors and diodes function. It then progresses to descriptions of the microchip design process and illustrates the manner in which modern IC circuits are laid-out.

The course next covers CMOS devices (PMOS and NMOS), and digital versus analog circuitry, followed by the presentation of a simplified microchip fabrication sequence and the equipment used in the fabrication process.

Finally, an overview of the packing process is presented and the various types of packing types are described.

The class is taught in a highly interactive style with key question reviews for each module. In-class exercises are provided, as well as a set of high-quality color notes that are profusely illustrated.

Course Topics:

Basic Electronics - Voltage, Current, Resistance, electrical circuits, Ohm's Law, electrical components (transistors, capacitors, diodes, resistors)

Semiconductor Fundamentals - the PN junctions (forward and reversed bias), MOSFETs, PMOS, NMOS, CMOS

Microchip Design - Logic gates, physical layout, Logic design, simulation tools, chip layout, design rule checks, mask generation, silicon prototype and debug, design revision and final qualification

Silicon Processing Technology - Atomic Layer Deposition (ALD), Chemical Mechanical Polishing (CMP), Chemical Vapor Deposition (CVD), Cleaning technology, Electro-plating, Etch, Ion Implantation, Lithography, Physical Vapor Deposition (PVD), and Rapid Thermal Processing (RTP)

Microchip Fabrication - A step-by-step fabrication sequence for a modern microchip is described in detail

Microchip Packaging - the backend process flow, wire bonding, Chip Scale Packaging (CSP), Stacked CSP, Wafer Level Packaging (WLP), the flip-chip process, System-in-Package (SiP), Multi-Chip-Modules (MCM), System on Chip (SoC), stacked die, Package-in-Package (PiP), 3D Packaging

 

Cost: $595.00/Student

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